Semiconductor component, has plastic compound arranged between another plastic compound and edge sides of adhesive layer and chip and upper side of chip such that latter plastic compound does not have physical contact to chip and layer

摘要

The component has a semiconductor chip stack (2) and a component carrier (4), where a semiconductor chip (5) in its rear side (6) is fixed on the carrier. Another semiconductor chip (8) in its rear side (9) is glued on an upper side (7) of the former chip over an adhesive layer (10). A plastic compound is arranged between another plastic compound (11) and edge sides (12-15) of the adhesive layer and the latter chip and the upper side of the latter chip in such a manner that the latter plastic compound does not have physical contact to the latter chip and to the adhesive layer. An independent claim is also included for a method of manufacturing a semiconductor component.