Procedure for indirect inscription of glass by passing focused laser beam of appropriate wave length through the glass on absorbing substrate such as metal/semi-metal and bringing the substrate to the upper surface of the glass

摘要

The procedure for indirect inscription of glass, comprises passing focused laser beam of appropriate wave length through the glass on absorbing substrate such as metal/semi-metal and bringing the substrate in direct contact or in a constant distance to the upper surface of the glass. The focused laser beam produces an energy density, which leads to a vaporization of substrate parts under formation of vapor radiation, which condenses on the side of the glass faced to the inscription material. The procedure for indirect inscription of glass, comprises passing focused laser beam of appropriate wave length through the glass on absorbing substrate such as metal/semi-metal and bringing the substrate in direct contact or in a constant distance to the upper surface of the glass. The focused laser beam produces an energy density, which leads to a vaporization of substrate parts under formation of vapor radiation, which condenses on the side of the glass faced to the inscription material. The inscription is formed through adhering substrate part or through removing of parts of glass depending upon the level of the energy density. The substrate parts are heated at a temperature that leads to additional local material tension with crack formation or to local fusion on the upper surface of the glass. Depending on the used substrate and glass, the type of the inscription is adjusted over the beam parameters of the laser like focus diameter, deflecting speed, repetition rate and average capacity relevant to the level of the energy density. The metal or the semi-metal is used in the form of a disk or as a thin layer coated on a compact or flexible carrier material. The semi-metal is used in poly- or mono crystalline form as wafer-material and as amorphous coating layer on the carrier material. One side of the glass is coated with an electrical conductive oxide layer. The coated side of the glass displays in the direction of the substrate during the inscription, which is formed on the coated side. The laser ray is deviated during the inscription with Galvo scanner by mechanical movement of the laser optic relative to the glass and the substrate. The laser ray is fixed during the inscription. The substrate is further transported relative to the already inscripted area after every inscription process. The inscription process is carried out under vacuum or a protective gas atmosphere.