首页> 外国专利> Device for the reduction in thermal stresses due to the use of compensators which consists of flexible, highly flexible material

Device for the reduction in thermal stresses due to the use of compensators which consists of flexible, highly flexible material

机译:通过使用由柔性,高度柔性材料组成的补偿器来减少热应力的装置

摘要

The present invention relates to a device for low-tension compensation of the thermally induced changes in length of adjacent barrier layers in a tank for storage and transport of cryogenic media. The compensation takes place in that in the between or on the insulating layers (5) barrier layers (2) located at distances interruptions (2a) are arranged, which, with a highly flexible material, the compensator (1) can be closed, which in turn in a gas-tight manner with the barrier layers (2) is connected.
机译:用于低张力补偿的装置本发明涉及一种用于对低温介质的储存和运输的罐中的相邻阻挡层的热引起的长度变化进行低张力补偿的装置。进行补偿的方式是,在绝缘层(5)之间或之上的隔离层(2)以一定的距离布置中断点(2a),该中断点(2a)可以用高度柔性的材料封闭,补偿器(1)可以关闭。继而以气密的方式与阻挡层(2)连接。

著录项

  • 公开/公告号DE102006043476B4

    专利类型

  • 公开/公告日2008-06-19

    原文格式PDF

  • 申请/专利权人

    申请/专利号DE20061043476

  • 发明设计人

    申请日2006-09-15

  • 分类号F17C3/02;F17C3/04;F17C3/06;

  • 国家 DE

  • 入库时间 2022-08-21 19:49:42

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号