首页> 外国专利> Semiconductor component has metal layer comprising coherent section, and other metal layer is arranged on coherent section of former metal layer, where latter metal layer is structured between layered regions

Semiconductor component has metal layer comprising coherent section, and other metal layer is arranged on coherent section of former metal layer, where latter metal layer is structured between layered regions

机译:半导体组件具有包括相干部分的金属层,并且其他金属层布置在前者金属层的相干部分上,其中后者金属层构造在分层区域之间

摘要

The component has a metal layer (1) comprising a coherent section. The other metal layer (2) is arranged on the coherent section of the former metal layer. The latter metal is harder than the former metal. The latter metal layer is structured between two layered regions (2a,2b) arranged on the coherent section of the former metal layer. The latter metal comprises boron or phosphorous containing metal and boron or phosphorous containing metal alloy. Independent claims are also included for the following: (1) a contact element comprising a layer pile with a continuous sub-area of a metallization layer of a semiconductor component (2) a method for producing a semiconductor component.
机译:该部件具有包括相干部分的金属层(1)。另一个金属层(2)布置在前一个金属层的相干部分上。后一种金属比前一种金属硬。后一个金属层构造在布置在前一个金属层的相干部分上的两个分层区域(2a,2b)之间。后一种金属包括含硼或含磷的金属和含硼或含磷的金属合金。还包括以下方面的独立权利要求:(1)包括具有堆垛的接触元件,该堆垛具有半导体组件的金属化层的连续子区域(2)制造半导体组件的方法。

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