Wet treatment of substrates, e.g. circuit boards, uses spray of treating agent in direction of transport of substrate, perforated interrupter plate being used so that spray only contacts substrate intermittently

摘要

Wet treatment of substrates (6), e.g. circuit boards, wafers or hybrid materials, using an immersion or continuous process, uses a spray (2) of treating agent in the direction of transport of the substrate. A perforated interrupter plate (3) is used so that the spray only contacts the substrate intermittently. An independent claim is included for apparatus for carrying out the method.