Spray Photoresist Development on Multiple Hybrid Microcircuit Substrates.

摘要

The investigation revealed that spray development of Shipley AZ1350J photoresist on 95-by 114-millimeter substrates will maintain a line-width deviation less than +-20microinches (+-0.5mu m) on 5-mil (127mu m) circuit paths. The overall photolithography process is controlled to allow only a +-3-percent line-width change on 5-mil paths.