首页> 外国专利> Method for determination of soldering profile with rework of conductor board, involves heating housing of sample element with hot-air equipment for determination of temperature distribution

Method for determination of soldering profile with rework of conductor board, involves heating housing of sample element with hot-air equipment for determination of temperature distribution

机译:通过导体板返工确定焊接轮廓的方法,包括用热风设备加热样品元件的外壳以确定温度分布

摘要

The method involves heating housing of a sample element (2) with hot-air equipment (5) for the determination of the temperature distribution. The temperature of the housing of the sample element is determined with an arranged temperature sensor (3) at the housing of the sample element in such a manner, that during a rise phase for reaching a permissible temperature for the housing of the sample element is not exceeded to a permissible temperature gradient of the sample element.
机译:该方法包括用热空气设备(5)加热样品元件(2)的外壳,以确定温度分布。样品元件的壳体的温度通过在样品元件的壳体上布置的温度传感器(3)来确定,使得在上升阶段不会达到样品元件的壳体的允许温度。超过样品元素的允许温度梯度。

著录项

  • 公开/公告号DE102007019116A1

    专利类型

  • 公开/公告日2008-10-30

    原文格式PDF

  • 申请/专利权人 MARTIN GMBH;

    申请/专利号DE20071019116

  • 发明设计人

    申请日2007-04-23

  • 分类号H05K3/34;G01N25/00;

  • 国家 DE

  • 入库时间 2022-08-21 19:49:14

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