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Light source has multiple chips, where each chip has light emitting diode, and encapsulating layer is presented on each chip, and cover is connected with light emitting diode carrier
Light source has multiple chips, where each chip has light emitting diode, and encapsulating layer is presented on each chip, and cover is connected with light emitting diode carrier
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机译:光源有多个芯片,每个芯片上都有发光二极管,每个芯片上都有封装层,盖子与发光二极管载体相连。
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摘要
The light source (30) has multiple chips (56), where each chip has light emitting diode (LED). The LED carrier has a metallic core and the upper surface is connected with a circuit layer and the chips are connected with the circuit layer. A cover (40) is connected with the LED carrier, where the cover has an opening (42) by which the light of LED is emitted. A cupola-shaped encapsulating layer is present on each chip and the encapsulating layer is placed at a distance from the sides of opening in such a manner that an air gap lies between the encapsulating layers and the sides.
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