Projection exposure apparatus for semiconductor lithography, has temperature regulating element i.e. Peltier element, regulating temperature of regions of optical elements, where sensor is placed in edge region of optical elements

摘要

The apparatus (1) has optical elements (8) e.g. lens, including an outer surface in the shape of a lateral surface of a cylinder. Sensors i.e. Peltier elements, determine a temperature of regions of optical elements, where the sensors are placed at identical angular distances along a circumference of one of the optical elements. A temperature regulating element i.e. Peltier element, regulates the temperature of the regions of the optical elements, where the sensor is placed in an edge region of the optical elements. An independent claim is also included for a method for determining a temperature of regions of optical element of a projection exposure apparatus.