Encapsulation module producing and/or micromechanical arrangement encapsulating method, involves forming insulated material mound on base of semiconductor material by structuring and/or etching process

摘要

The method involves generating a base of a semiconductor material during a process of the formation of an electronic connector unit e.g. through contact (2). The electronic connector unit is arranged on the base of the semiconductor material. An insulated material mound is formed on the base of the semiconductor material by a structuring and/or etching process during the process of the formation of the electronic connector unit, where the insulated material mound represents a semiconductor electrode (3). An independent claim is also included for an encapsulation module for encapsulating a micromechanical structure and/or micromechanical arrangement.