Printed circuit board for electronic device, has conductive pads provided on one of two surfaces of support, where one conductive pad has part that is exposed to soldering and that has width lower than specific values

摘要

The board (101) has a hole (3) for traversing a support (102) made of insulating material and for receiving pins of electrical components. Conductive pads (103, 104) are provided on one of two surfaces (105, 106) of the support and surround the holes to fix the components with soldering. Thermal expansion coefficient of the support according to an axis perpendicular to the support is lower than 60 micrometer per meter per degree Celsius, for a temperature region lower than 150 degree Celsius. One pad has a part that is exposed to the soldering and has a width lower than 0.30 millimeters.