The invention proposes a process for bonding two substrates together during which the surfaces of said substrates are brought into contact, comprising at least one step of cleaning the surface of one and / or the other of the substrates. to stick before contacting their surfaces, characterized in that the cleaning step is performed so that each cleaned surface is slightly roughened, and in that the bonding is further preceded by a heating of at least one substrate to be bonded, said heating being initiated before contacting the surfaces of the substrates and prolonged at least until they are brought into contact.
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