首页> 外国专利> COPPER FOIL SHEET FOR OPENING LASER-DRILLED HOLE

COPPER FOIL SHEET FOR OPENING LASER-DRILLED HOLE

机译:激光打孔开口用铜箔纸

摘要

PROBLEM TO BE SOLVED: To provide a copper foil sheet for opening a laser-drilled hole, which has excellent charcteristics for opening of the laser-drilled hole by using low laser light energy that a printed wiring board is not damaged and which enables the production of highly integrated printed wiring boards necessary for small sized and lightweight electric apparatuses.;SOLUTION: The copper foil sheet for opening the laser-drilled hole is obtained by: forming an alloy minute roughening particle layer consisting of Cu, Ni and Co on the surface of the copper foil sheet to be irradiated with laser light; forming a flat and smooth cover plated layer consisting of Co or Ni on the alloy minute roughening particle layer; sticking another alloy minute roughening particle layer consisting of Cu and Co or Cu, Ni and Co to the surface of the copper foil sheet to be stuck to a resin; and treating the surface of the alloy minute roughening particle layer-stuck copper foil sheet to be stuck to the resin with a silane coupling agent.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种用于打开激光钻孔的铜箔片,该铜箔片通过使用低激光能量而具有优异的打开激光钻孔的特性,从而不会损坏印刷线路板,并且能够进行生产小型,轻型电气设备所需的高度集成的印刷线路板;;解决方案:用于打开激光钻孔的铜箔片是通过以下方式获得的:在表面上形成由Cu,Ni和Co组成的合金微小粗糙颗粒层所述铜箔片要被激光照射;在合金微小粗糙颗粒层上形成由Co或Ni组成的平整光滑的镀层。将由Cu和Co或Cu,Ni和Co组成的另一合金微小粗糙颗粒层粘附到铜箔片的表面上以粘附到树脂上;并用硅烷偶联剂处理粘附在树脂上的微小粗糙化颗粒层的铜箔片的表面。;版权所有:(C)2010,日本特许会计师事务所

著录项

  • 公开/公告号JP2009235580A

    专利类型

  • 公开/公告日2009-10-15

    原文格式PDF

  • 申请/专利权人 FURUKAWA ELECTRIC CO LTD:THE;

    申请/专利号JP20090171239

  • 发明设计人 NAKAOKA TADAO;FUKUDA HIROSHI;

    申请日2009-07-22

  • 分类号C25D5/12;C25D5/48;C25D7/06;

  • 国家 JP

  • 入库时间 2022-08-21 19:46:12

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