Carrier sheet with copper foil, a manufacturing method of copper foil with a carrier sheet, copper-clad laminate using the surface-treated copper foil with a carrier sheet and surface-treated copper foil with the carrier sheet

摘要

PROBLEM TO BE SOLVED: To provide a copper foil with carrier sheet in which a carrier sheet can be peeled from a copper foil even if it is used for print wiring boards manufactured by press-worked at a temperature of 300C or higher.;SOLUTION: For solving the problem, the copper foil with carrier sheet is employed which has a copper foil on the surface of a carrier sheet through a joining interface layer so as to make the carrier sheet physically peelable. The joining interface layer comprises a metal layer and a carbon layer, and preferably the metal layer has a thickness of 1-50 nm and the carbon layer has a thickness of 1-20 nm.;COPYRIGHT: (C)2009,JPO&INPIT