首页> 外国专利> WHITE ALKALI-DEVELOPABLE PHOTOCURABLE AND THERMOSETTING SOLDER RESIST COMPOSITION, AND METAL-BASE CIRCUIT SUBSTRATE USING THE SAME

WHITE ALKALI-DEVELOPABLE PHOTOCURABLE AND THERMOSETTING SOLDER RESIST COMPOSITION, AND METAL-BASE CIRCUIT SUBSTRATE USING THE SAME

机译:白色碱可显影的可光热固熔抗蚀剂组成,以及使用相同的金属基电路基质

摘要

PROBLEM TO BE SOLVED: To provide a high-reflectance alkali-developable photocurable and thermosetting solder resist composition, and a metal-base circuit substrate using the same having a high reflection function.;SOLUTION: The white alkali-developable photocurable and thermosetting solder resist composition comprises (A) a carboxyl-containing (meth)acrylate having no aromatic ring, (B) a (meth)acryl compound, (C) a photopolymerization initiator, (D) an epoxy compound, (E) a curing agent for thermosetting, (F) a curing catalyst for thermosetting, (G) inorganic powder, and (H) an organic solvent. The metal-base circuit substrate comprises an insulating layer formed on metal foil, and a circuit formed on the insulating layer wherein a white film is formed on the insulating layer and the circuit using the solder resist composition.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:提供一种高反射率的碱显影光固化和热固性阻焊剂组合物,以及使用该组合物的金属基电路基板,其具有高反射功能。组合物包含(A)不具有芳环的含羧基(甲基)丙烯酸酯,(B)(甲基)丙烯酸化合物,(C)光聚合引发剂,(D)环氧化合物,(E)热固性固化剂(F)热固性固化催化剂,(G)无机粉末,(H)有机溶剂。金属基电路基板包括:形成在金属箔上的绝缘层;和形成在绝缘层上的电路,其中,在该绝缘层上形成白色膜;以及使用阻焊剂组合物的电路。;版权:(C)2009,日本特许厅

著录项

  • 公开/公告号JP2009194222A

    专利类型

  • 公开/公告日2009-08-27

    原文格式PDF

  • 申请/专利权人 DENKI KAGAKU KOGYO KK;

    申请/专利号JP20080034808

  • 发明设计人 OGUMA TAKEMI;

    申请日2008-02-15

  • 分类号H05K3/28;G03F7/004;G03F7/027;

  • 国家 JP

  • 入库时间 2022-08-21 19:45:30

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