METHOD OF MANUFACTURING PRINTED-CIRCUIT BOARD, PRINTED-CIRCUIT BOARD, AND ELECTRONIC APPARATUS WITH PRINTED-CIRCUIT BOARD THEREOF

摘要

PPROBLEM TO BE SOLVED: To provide a method of manufacturing a printed-circuit board capable of easily manufacturing the printed-circuit board preventing a flow out of an underfill material to the backside, and to provide the printed-circuit board and an electronic apparatus with the printed-circuit board. PSOLUTION: The method of manufacturing the printed-circuit board includes: a step of preparing the printed-circuit board equipped with through-holes and a plurality of electrode pads with a plurality of bumps provided on one surface of a semiconductor package mounted; a step of applying a bonding material to respective surfaces of the plurality of electrode pads and through-holes of the printed-circuit board prepared by the step of preparing; a step of mounting the plurality of bumps of the semiconductor package faced each other on the plurality of electrode pads of the printed-circuit board with the bonding material applied by the step of applying; a step of bonding the bumps and the electrode pads by the bonding material by heating the printed-circuit board with the semiconductor package mounted by the step of mounting; and a step of casting filling material between the semiconductor package and the printed-circuit board. PCOPYRIGHT: (C)2009,JPO&INPIT