首页> 外国专利> POLISHING METHOD USING LASER BEAM MACHINING, POLISHING DEVICE, AND POLISHED CUTTING TOOL

POLISHING METHOD USING LASER BEAM MACHINING, POLISHING DEVICE, AND POLISHED CUTTING TOOL

机译:使用激光束加工,抛光设备和抛光刀具的抛光方法

摘要

PPROBLEM TO BE SOLVED: To obtain a polishing depth invariable of a distance from a cutting edge ridgeline without causing microcracks and the graphitization of diamond particles by a polishing. PSOLUTION: The polishing method using a laser beam machining comprises: a cross-sectional diameter-fixing step where the cross-sectional diameter 2 of a focusing beam machining energy region when a repeated ultrashort light pulse laser beam 3 is focused with a focusing lens 2 is made almost fixed in a prescribed range to the direction of the optical axis 21 of the focusing lens 2; an optical axis regulation step where the optical axis 21 of the focusing lens 2 is adjusted so as to be almost parallel to the polishing face 72 in a polishing object 7; a focusing beam west part adjustment step where the focusing beam west part 31 of an ultrashort light pulse laser beam 3 by the focusing lens 2 is regulated so as to be present at the polishing part 73; and a movement step where the focusing beam west part 31 by the focusing lens 2 is relatively moved at a prescribed moving velocity along the polishing part 73. PCOPYRIGHT: (C)2009,JPO&INPIT
机译:

要解决的问题:获得到切削刃棱线的距离不变的抛光深度,而不会引起微裂纹和抛光导致的金刚石颗粒的石墨化。

解决方案:使用激光束加工的抛光方法包括:横截面直径固定步骤,其中当重复超短光脉冲激光束3聚焦时,聚焦束加工能量区域的横截面直径2。调焦透镜2在调焦透镜2的光轴21方向上几乎固定在规定范围内。光轴调节步骤,其中调节聚焦透镜2的光轴21以使其几乎平行于抛光物体7中的抛光面72;聚焦束西部分调节步骤,其中通过聚焦透镜2调节超短光脉冲激光束3的聚焦束西部分31,使其出现在抛光部分73上。

版权:(C)2009,日本特许厅&INPIT;以及一个移动步骤,在该步骤中,聚焦透镜2的聚焦光束西部分31沿着抛光部分73以规定的移动速度相对移动。

著录项

  • 公开/公告号JP2009066627A

    专利类型

  • 公开/公告日2009-04-02

    原文格式PDF

  • 申请/专利权人 AISIN SEIKI CO LTD;

    申请/专利号JP20070238087

  • 发明设计人 ATSUMI TAKAFUMI;

    申请日2007-09-13

  • 分类号B23K26/36;B23K26;

  • 国家 JP

  • 入库时间 2022-08-21 19:43:50

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