首页> 外国专利> TERRACE TYPE THIN-PLATE SUBSTRATE, MAKING METHOD OF TERRACE TYPE THIN-PLATE SUBSTRATE, PSEUDO PHASE MATCHING SECOND HARMONIC GENERATING DEVICE, HIGH-DENSITY RECORDING MEDIUM, LASER, OPTICAL MODULATOR, AND POLARIZATION INVERTING METHOD OF TERRACE TYPE THIN-PLATE SUBSTRATE

TERRACE TYPE THIN-PLATE SUBSTRATE, MAKING METHOD OF TERRACE TYPE THIN-PLATE SUBSTRATE, PSEUDO PHASE MATCHING SECOND HARMONIC GENERATING DEVICE, HIGH-DENSITY RECORDING MEDIUM, LASER, OPTICAL MODULATOR, AND POLARIZATION INVERTING METHOD OF TERRACE TYPE THIN-PLATE SUBSTRATE

机译:露台型薄板基板,露台型薄板基板的制作方法,伪相位匹配第二谐波发生装置,高密度记录介质,激光,光调制器,以及露台型薄膜的极化率反转方法

摘要

PROBLEM TO BE SOLVED: To make a thin-plate substrate whose both surfaces are usable in a short time at low cost.;SOLUTION: The terrace type thin-plate substrate 1 which has a non-processed section 2 having a first main surface 11 and a second main surface 12 and a cut section 3 having the first main surface 11 and a cut surface 13 by cutting a surface 31 having a surface perpendicular to a self-polarization direction as the first main surface 11 by using a dicer, is manufactured. The substrate 13 is installed so as to have the first main surface 11 in parallel to a diameter direction of an extremely thin peripheral cutting edge 32 of the dicer, which is pressed against a side surface of the substrate 31 to cut off a portion of the substrate 31. As the cutting-off operation, an operation to cut off a surface-layer portion including the second main surface 12 first by pressing the extremely thin peripheral cutting edge 32 against a side surface end on the side of the second main surface 12 and then to cut off a surface-layer portion including a cut surface L1 formed as a result by pressing the extremely thin peripheral cutting edge 32 against a side surface end on the side of the cut surface L1 is repeatedly performed to shorten the distance between the first main surface 11 and cut surface 13.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:制造低成本且可在短时间内使用两个表面的薄板基板;解决方案:平台型薄板基板1的未加工部2具有第一主表面11通过使用切块机,通过切割具有垂直于自偏振方向的表面的表面31作为第一主表面11,来制造第二主表面12和具有第一主表面11和切割表面13的切割部3。 。基板13被安装成具有与切块机的极薄的周缘切削刃32的直径方向平行的第一主面11,该第一主面11被压在基板31的侧面上而切掉刀具的一部分。作为切断操作,首先通过将极细的周缘切削刃32压向第二主表面12侧的侧面端部来切断包括第二主表面12的表面层部分的操作。然后,通过将极薄的周缘切削刃32压靠在切削面L <侧的侧面端部上,从而切削形成包括切削面L 1 的表面层部分。重复执行Sub> 1 以缩短第一主表面11和切割表面13之间的距离。版权所有:(C)2009,JPO&INPIT

著录项

  • 公开/公告号JP2009175385A

    专利类型

  • 公开/公告日2009-08-06

    原文格式PDF

  • 申请/专利权人 NATIONAL UNIV CORP SHIZUOKA UNIV;

    申请/专利号JP20080013329

  • 发明设计人 MINAKATA MAKOTO;

    申请日2008-01-24

  • 分类号G02F1/37;

  • 国家 JP

  • 入库时间 2022-08-21 19:43:19

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