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GaN-BASED LED CHIP AND METHOD OF MANUFACTURING GaN-BASED LED CHIP

机译:GaN基LED芯片及其制造方法

摘要

PROBLEM TO BE SOLVED: To provide a GaN-based LED chip excellent in light extracting efficiency which can be configured by subsequently laminating an n-type layer and a p-type layer on a substrate to form a laminate structure including a light emitting portion of pn-junction type.;SOLUTION: The GaN-based LED chip has an ohmic electrode 13 formed on the upper surface of the p-type layer 12-2, and an insulation protective film 14 for covering the upper surface of the p-type layer 12-2 around the ohmic layer 13. The side surface 12a of the laminate structure 12 is formed by dry etching, and at least a part thereof has a cross section formed by cutting the laminate structure at a plane perpendicular to a laminating direction is an uneven shape as a corrugated shape.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:提供一种光提取效率优异的GaN基LED芯片,其可以通过随后在基板上层压n型层和p型层以形成包括发光层的发光部分的层压结构来配置。解决方案:GaN基LED芯片具有在p型层12-2的上表面上形成的欧姆电极13和覆盖p型层上表面的绝缘保护膜14层12-2围绕欧姆层13。层叠结构12的侧表面12a通过干法蚀刻形成,并且其至少一部分具有通过在垂直于层叠方向的平面上切割层叠结构而形成的横截面。不平整形状为波纹状。;版权所有:(C)2009,日本特许厅&INPIT

著录项

  • 公开/公告号JP2009176781A

    专利类型

  • 公开/公告日2009-08-06

    原文格式PDF

  • 申请/专利权人 MITSUBISHI CHEMICALS CORP;

    申请/专利号JP20080010943

  • 发明设计人 HIRAOKA SUSUMU;

    申请日2008-01-21

  • 分类号H01L33/00;

  • 国家 JP

  • 入库时间 2022-08-21 19:42:59

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