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The method of forming the field-effect transistor, and the method of forming transistor gate array and the integrated circuit which includes the gate array peripheral circuit

机译:形成场效应晶体管的方法,以及形成晶体管栅极阵列和包括该栅极阵列外围电路的集成电路的方法

摘要

This invention, method, the method of forming the field-effect transistor gate and of forming transistor gate array and the integrated circuit which includes the gate array peripheral circuit the method of forming the field-effect transistor, the first gate and includes the method of forming the integrated circuit which includes the transistor gate array which includes the second ground insulated gate. With one execution example, as for the method of forming the field-effect transistor, the baseplate (11) the masking material (22, 24 and 26) the step which is formed is included on the semi- conductive material. The trench (30) passing, the masking material (22, 24 and 26) the semi- conductive material (11) it is formed in. The gate dielectric material (32) the semi- conductive material (11) the trench in (30) is formed inside. The gate material (34), the masking material (22, 24 and 26) the trench in (30) inside, and the semi- conductive material (11) the trench in (30) in inside, the gate dielectric material (32) is accumulated on. The source/drain territory is formed. Other feature and execution example are examined. Selective figure Figure 10
机译:本发明的方法,形成场效应晶体管栅极的方法,形成晶体管栅极阵列的方法以及包括该栅极阵列外围电路的集成电路,该场效应晶体管的形成方法,第一栅极以及包括形成包括晶体管的集成电路,该晶体管的栅极阵列包括第二接地绝缘的栅极。在一个执行示例中,关于形成场效应晶体管的方法,在半导体材料上包括基板(11),掩膜材料(22、24和26),该形成的步骤。沟槽(30)通过掩膜材料(22、24和26)形成在其中的半导电材料(11)。栅介质材料(32)半导电材料(11)在其中形成沟槽(30) )形成在内部。栅极电介质材料(32)的栅极材料(34),内部(30)中的沟槽的掩模材料(22、24和26)以及内部(30)中的沟槽的半导电材料(11)。累积在。源极/漏极区域已形成。检查其他功能和执行示例。<选择图>图10

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