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In processed item of polyimide application metallic plate and on secondary

机译:在聚酰亚胺应用金属板的加工项目中以及二次加工中

摘要

PROBLEM TO BE SOLVED: To obtain a workpiece of a polyimide laminated body on which punching processing, cutting processing, drilling processing, notching processing, etching processing, grinding processing, plating processing, bending processing and drawing processing can be easily performed and which exhibits excellent heat resistance.;SOLUTION: A base material, e.g. a metal sheet, a metal foil, a heat-resistant resin sheet such as a polyimide, a PEEK film and a polyimide, the said films and an inorganic base material such as a silicon wafer is coated with a polyimide obtained by polycondensation of at least one ingredient of alicyclic diamines of the below described formula (1) ( wherein aminomethyl groups are bonded at the positions 2 and 5 or at the positions 2 and 6) with tetracarboxylic acid dianhydride of the below described formula (2) (wherein W is a tetravalent organic group). A workpiece and a secondary workpiece are obtained by using the metal sheet.;COPYRIGHT: (C)2002,JPO
机译:解决的问题:为了获得聚酰亚胺层压体的工件,在其上可以容易地进行冲压处理,切割处理,钻孔处理,刻槽处理,蚀刻处理,磨削处理,镀覆处理,弯曲处理和拉深处理,并且表现出优异的性能。耐热性;解决方案:一种基础材料,例如金属片,金属箔,聚酰亚胺,PEEK膜,聚酰亚胺等耐热性树脂片,上述膜和硅晶片等无机基材被至少通过缩聚得到的聚酰亚胺覆盖。下式(1)的脂环族二胺的一种成分(其中氨基甲基在2和5位或在2和6位键合)与下述式(2)的四羧酸二酐(其中W为四价有机基团)。用该金属板制得一个工件和一个辅助工件。;版权:(C)2002,JPO

著录项

  • 公开/公告号JP4357724B2

    专利类型

  • 公开/公告日2009-11-04

    原文格式PDF

  • 申请/专利权人 三井化学株式会社;

    申请/专利号JP20000269611

  • 发明设计人 小口 貴久;山下 渉;

    申请日2000-09-06

  • 分类号B32B27/34;B32B15/088;B32B15/08;C08G73/10;

  • 国家 JP

  • 入库时间 2022-08-21 19:40:04

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