Processing the sample which possesses with the suffering analysis field which was formed to the aspect of one side of the acicular body null substrate and the aforementioned substrate which are used

摘要

PPROBLEM TO BE SOLVED: To provide a needle-like body efficiently performing the APFIM analysis of a flat sheet-like or thin film-like sample, used in a semiconductor process or the development of a semiconductor device, having high reproducibility and reliability. PSOLUTION: This needle-like body forming method includes: a jointing process of jointing a conductive material 16 to the surface of a sample 10, which is equipped with a substrate 11 and the region 17 to be analyzed formed on the substrate, to obtain a composite 18; and a processing process of processing the composite 18 into the needle-like body, equipped with a pointed part which is equipped with at least a part of the region 17 to be analyzed, and a support part, equipped with at least a part of the conductive material 16 and bonded to the pointed part. PCOPYRIGHT: (C)2006,JPO&NCIPI