In the two-layer flexible copper-clad laminate which is obtained with the direct metallization modulo which forms seed

摘要

PROBLEM TO BE SOLVED: To provide a two-layer flexible copper clad laminate which is obtained by using a direct metallization method, and in which repellents such as Cr are not comprised in a seed layer.;SOLUTION: The one side two-layer flexible copper clad laminate is obtained by a direct metallization method where a seed layer is formed on one side of a polyimide resin film base material, and a copper layer is formed on the seed layer. In the seed layer, each film and layer of: (a) a nickel based thin film with a mean thickness of 50 to 700 nm; (b) an amorphous cobalt film with a mean thickness of 10 to 80 nm made amorphous; and (c) a mixed layer with a mean thickness of 50 to 180 nm in which cobalt particles and/or cobalt oxide particles and a polyimide resin are coexist lie in a laminated state.;COPYRIGHT: (C)2005,JPO&NCIPI