Plasma processing apparatus and magnet arrangement make the plasma generation point cusp magnetic field

摘要

PROBLEM TO BE SOLVED: To provide magnet arrangement making point-cusp magnetic field for plasma generation that can produce uniform plasma distribution over the whole surface of a wafer so that a uniform processing speed may be realized, and to provide a plasma processing system.;SOLUTION: The magnet arrangement is used in the plasma processing system having a top electrode 1 placed above a surface of the wafer 23 and an outer insulating member 3 for supporting the electrode 1. The magnet arrangement is composed of a plurality of magnets 6 separately arranged on the outer surface of the electrode 1 and a plurality of magnets 6 separately arranged on the region corresponding to the outer surface of the insulating member 3. The magnets connected with the electrode 1 and the magnets connected with the insulating member 3 are arranged to satisfy a positional and magnetic relationship creating the predetermined magnet arrangement.;COPYRIGHT: (C)2004,JPO