Cooling manner of the electronic parts where it possesses the cooling manner of the electronic parts and the thermal spraying equipment null circulation

摘要

PROBLEM TO BE SOLVED: To provide an electronic component cooling method for cooling electronic components by one air compressor without respectively using air compressors for two heat sinks or without preparing air compressors corresponding to two air compressors when constituting the cooling structure of two heat sinks or cooling the electronic components by an air compressor whose discharge flow rate is less than a current discharge flow rate when constituting the cooling structure of one heat sink.;SOLUTION: Compressed air is supplied to a hollow part of one heat sink 5 out of two heat sinks 5, 6, respectively having hollow parts into which air is allowed to flow and mounting electronic components 7 on faces other than the hollow parts. The hollow part of the other heat sink 6 is opened so as to be connected to outside atmosphere. Then a part of compressed air is branched and supplied to the hollow part of the other heat sink 6.;COPYRIGHT: (C)2005,JPO&NCIPI