首页> 外国专利> Production manner of thin film formation manner and the production device and semiconductor equipment of the thin film structure which uses this, and production manner of the electro-optic device

Production manner of thin film formation manner and the production device and semiconductor equipment of the thin film structure which uses this, and production manner of the electro-optic device

机译:薄膜形成方式的生产方式以及使用该薄膜结构的薄膜结构的生产装置和半导体设备以及电光装置的生产方式

摘要

To reduction manufacturing cost by decreasing the futile use of a coating liquid and to improve in-plane uniformity of a thin film and the sharpness of contour in a method of forming the thin film by applying a coating liquid ON a substrate. SOLUTION: The thin film forming method has a process for forming a bank part 21 ON a contour part in a region where the thin film is formed ON the substrate S by discharging a 1st coating liquid by ink-jet method and a process for discharging a 2n coating liquid containing film forming components which has nearly the same composition as the 1st coating liquid ON a pond part 23 surrounded by the bank part 21 by the ink-jet method.
机译:为了通过减少无用的涂布液来降低制造成本,并且通过在基板上涂布涂布液来形成薄膜的方法中,提高薄膜的面内均匀性和轮廓的清晰度。解决方案:薄膜形成方法包括通过喷墨法排出第一涂布液而在基板S上形成薄膜的区域中的轮廓部分上的堤部21上形成堤部21的步骤,以及通过在基板S上排出第一涂布液的步骤。通过喷墨法,在由堤部21包围的池部23上,含有具有与第一涂布液几乎相同的组成的成膜成分的第二涂布液。

著录项

  • 公开/公告号JP4192456B2

    专利类型

  • 公开/公告日2008-12-10

    原文格式PDF

  • 申请/专利权人 セイコーエプソン株式会社;

    申请/专利号JP20010324120

  • 发明设计人 足助 慎太郎;

    申请日2001-10-22

  • 分类号B05D1/26;G03F7/16;H01L21/027;H01L21/285;H01L21/768;

  • 国家 JP

  • 入库时间 2022-08-21 19:37:09

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