Ultra high purity copper, method for producing the same, and bonding wire made of ultra high purity copper

摘要

Ultra-high purity copper with a hardness of 40Hv or less and a purity of 8N or more (excluding O, C, N, H, S, P gas components). The above ultra-high purity copper, wherein each element of gas components O, S, and P is 1 wtppm or less. When manufacturing ultra-high purity copper by two-stage electrolysis using an electrolytic solution consisting of a copper nitrate solution, hydrochloric acid is added to the electrolytic solution consisting of the copper nitrate solution, and the electrolytic solution is circulated. A method for producing ultra-high purity copper, in which electrolysis is performed by two-stage electrolysis while removing impurities with a filter by temporarily setting the liquid to 10 ° C or lower. An object of this invention is to obtain the copper material which can be adapted to said thinning (drawing). The purpose is to efficiently produce ultra-high purity copper with a purity of 8N (99.999999wt%) or more, to provide the obtained ultra-high purity copper, and to obtain bonding wires for semiconductor devices that can be made particularly thin And