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Method of Protecting Semiconductor Chips from Mechanical and ESD Damage During Handling
Method of Protecting Semiconductor Chips from Mechanical and ESD Damage During Handling
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机译:在处理过程中保护半导体芯片免受机械和ESD损害的方法
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摘要
A method and apparatus are provided for protecting a semiconductor device from damage. The method may include the steps of providing an active semiconductor device on a surface of a semiconductor substrate where the active device is surrounded by an inactive semiconductor area, and providing a soft metallic guard element in the inactive semiconductor area around at least a portion of the periphery of the active device wherein the metallic guard element is connected to ground potential and not to the active device.
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