Apparatus for bonding camera module, equipment for assembling camera module having the apparatus, and method of assembling camera module using the equipment

摘要

An apparatus for bonding a camera module, equipment for assembling the camera module having the apparatus, and a method of assembling the camera module using the equipment. The apparatus include: a laser generator, which generates a laser beam, and a bonding head, which is connected to the laser generator through an optical fiber and applies the laser beam propagating through the optical fiber to contact portions of a camera unit having an image sensor and lenses and a flexible printed circuit board (FPCB) electrically connected to the image sensor, so that the contact portions can be heated and bonded to each other such that the camera unit and the FPCB are bonded to each other. Thus, a process of bonding the camera module can be performed within a relatively short time, compared to the case where a hot-bar or an oven is used.