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Electronic Device Testing Apparatus and Temperature Control Method in an Electronic Device Testing Apparatus

机译:电子设备测试装置及电子设备测试装置中的温度控制方法

摘要

An electronic device testing apparatus 1 comprising a temperature measurement device 51 for measuring a temperature of an IC device D based on a voltage of a thermal diode provided inside the IC device D, a temperature sensor 154 and a temperature applying device 153 provided to a pusher 150, and a calibration means for calculating a correction value from a difference of a measurement temperature of a predetermined IC device D by the temperature measurement device 51 and that by the temperature sensor 154; wherein a temperature of the IC device D to be tested is measured by the temperature measurement device 51 at an actual operation, and the temperature applying device 153 is controlled based on the obtained measurement temperature and a correction value calculated by the calibration means.
机译:电子设备测试装置 1 包括温度测量设备 51 ,该温度测量设备 51 用于基于设置在IC设备D内部的热敏二极管的电压来测量IC设备D的温度,设置在推动器 150上的温度传感器 154 和温度施加装置 153 以及用于根据差值计算校正值的校准装置。温度测量装置 51 和温度传感器 154测量预定IC装置D的测量温度; 其中,测量要测试的IC装置D的温度在实际操作中由温度测量装置 51 通过温度测量装置 51 进行控制,并且基于获得的测量温度和由校准装置计算出的校正值来控制温度施加装置 153

著录项

  • 公开/公告号US2009051381A1

    专利类型

  • 公开/公告日2009-02-26

    原文格式PDF

  • 申请/专利权人 SHIGERU HOSODA;MASAAKI OGAWA;

    申请/专利号US20050990435

  • 发明设计人 MASAAKI OGAWA;SHIGERU HOSODA;

    申请日2005-08-25

  • 分类号G01R31/02;

  • 国家 US

  • 入库时间 2022-08-21 19:33:06

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