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Electronic device testing apparatus and temperature control method in an electronic device testing apparatus

机译:电子设备测试装置及电子设备测试装置中的温度控制方法

摘要

An electronic device testing apparatus is described that includes a temperature measurement device for measuring a temperature of an IC device based on a voltage of a thermal diode provided inside the IC device, a temperature sensor and a temperature applying device provided to a pusher, and a temperature control portion for calculating a correction value from a difference of a measurement temperature of a predetermined IC device by the temperature measurement device and that by the temperature sensor. A temperature of the IC device to be tested is measured by the temperature measurement device at an actual operation, and the temperature applying device is controlled based on the obtained measurement temperature and the correction value calculated by the temperature control portion.
机译:描述了一种电子设备测试设备,该设备包括:温度测量设备,用于基于设置在IC设备内部的热敏二极管的电压来测量IC设备的温度;温度传感器和提供至推动器的温度施加设备;以及温度控制部分,用于根据温度测量装置和温度传感器的预定IC装置的测量温度之差来计算校正值。待测IC器件的温度在实际操作中由温度测量装置测量,并且基于所获得的测量温度和由温度控制部计算出的校正值来控制温度施加装置。

著录项

  • 公开/公告号US7768286B2

    专利类型

  • 公开/公告日2010-08-03

    原文格式PDF

  • 申请/专利权人 SHIGERU HOSODA;MASAAKI OGAWA;

    申请/专利号US20050990435

  • 发明设计人 MASAAKI OGAWA;SHIGERU HOSODA;

    申请日2005-08-25

  • 分类号G01R31/02;

  • 国家 US

  • 入库时间 2022-08-21 18:49:10

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