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Low-cost and ultra-fine integrated circuit packaging technique
Low-cost and ultra-fine integrated circuit packaging technique
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机译:低成本和超细集成电路封装技术
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摘要
A semiconductor package structure and the methods for forming the same are provided. The semiconductor package structure includes an interposer; a first plurality of bonding pads on a side of the interposer; a semiconductor chip; and a second plurality of bonding pads on a side of the semiconductor chip. The first and the second plurality of bonding pads are bonded through metal-to-metal bonds.
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