首页>
外国专利>
Through-Chip Via Interconnects for Stacked Integrated Circuit Structures
Through-Chip Via Interconnects for Stacked Integrated Circuit Structures
展开▼
机译:堆叠式集成电路结构的片上通孔互连
展开▼
页面导航
摘要
著录项
相似文献
摘要
A stacked IC structure has an integrated circuit (IC) having a front IC side, a back IC side, and a first conductive feature formed on the front IC side. A through-chip via connects to the first conductive feature on the front IC side. A substrate has an external circuit formed on a front surface. The IC attaches to the front surface of the substrate and the through-chip via forms a connection between the first conductive feature and the external circuit.
展开▼