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Technique for metal deposition by electroless plating using an activation scheme including a substrate heating process
Technique for metal deposition by electroless plating using an activation scheme including a substrate heating process
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机译:使用包括衬底加热工艺在内的活化方案通过化学镀进行金属沉积的技术
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摘要
In an enhanced technique for electroless metal deposition, the substrate is heated to or above the operating temperature for the specific plating solution, while the plating solution may be maintained at a non-critical low temperature to substantially prevent spontaneous self-decomposition within the plating tool. Hence, significant advantages with respect to process control and cost of ownership may be achieved.
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