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Coating liquid for formation of protective film for semiconductor processing, method for preparation of the same, and protective film for semiconductor processing made from the coating liquid

机译:用于形成半导体加工用保护膜的涂布液,其制备方法以及由该涂布液制成的半导体加工用保护膜

摘要

Disclosed is a coating liquid for forming a protective film having high film strength and a low specific dielectric constant for semiconductor processing, and a method for preparing the coating liquid. The coating liquid is a liquid composition comprising (a) silicon compound obtained by hydrolyzing tetraalkyl orthosilicate (TAOS) and alkoxysilane (AS) in the presence of tetraalkyl ammonium hydroxide (TAAOH) and water, or a silicon compound obtained by hydrolyzing or partially hydrolyzing tetraalkyl orthosilicate (TAOS) in the presence of tetraalkyl ammonium hydroxide (TAAOH) and water, mixing the hydrolyzed or partially hydrolyzed product with alkoxysilane (AS) or a hydrolyzed or partially hydrolyzed product thereof, and hydrolyzing all or a portion of the mixture, (b) an organic solvent, and (c) water. The coating liquid is characterized in that a quantity of water contained in the liquid composition is in the range from 35 to 65% by weight.
机译:公开了一种用于形成具有高膜强度和低比介电常数的用于半导体加工的保护膜的涂布液,以及制备该涂布液的方法。涂布液是液体组合物,其包含(a)在四烷基氢氧化铵(TAAOH)和水的存在下通过水解原硅酸四烷基酯(TAOS)和烷氧基硅烷(AS)获得的硅化合物,或通过水解或部分水解四烷基获得的硅化合物。在氢氧化四烷基铵(TAAOH)和水存在下的原硅酸盐(TAOS),将水解或部分水解的产物与烷氧基硅烷(AS)或其水解或部分水解的产物混合,然后水解全部或部分混合物,(b )有机溶剂,和(c)水。涂布液的特征在于,液体组合物中包含的水的量为35至65重量%。

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