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Abnormality cause specifying method, abnormality cause specifying system, and semiconductor device fabrication method
Abnormality cause specifying method, abnormality cause specifying system, and semiconductor device fabrication method
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机译:异常原因确定方法,异常原因确定系统以及半导体装置的制造方法
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摘要
A feature amount is generated by standardizing inspection data related to a fabrication unit for each type, a similar set including fabrication units corresponding to similar feature amounts is formed by comparing the feature amounts, and apparatus difference analysis is performed between a plurality of fabrication units forming the similar set. A two-level orthogonal table is used to determine whether to adopt a feature amount of each type, and some feature amounts are not used in the apparatus difference analysis and the like by optimizing the smaller-the-better characteristic or the larger-the-better characteristic of a test value of the apparatus difference analysis, thereby reducing the calculation amount and accurately and efficiently specifying an abnormality cause.
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