首页> 外国专利> Integrated photonic semiconductor devices having ridge structures that are grown rather than etched, and methods for making same

Integrated photonic semiconductor devices having ridge structures that are grown rather than etched, and methods for making same

机译:具有被生长而不是被蚀刻的脊结构的集成光子半导体器件及其制造方法

摘要

A SAG technique is used to grow the ridge structure in a photonic semiconductor device, such as an electroabsorption modulator integrated with a distributed feedback laser (EML) assembly. The adoption of this SAG technique to grow the ridge structure results in the formation of a self-assembled and self-aligned ridge structure that has a very precise configuration. The use of this process enables straight, bent and tilted ridge structures to be formed with high precision. In addition, because the ridge structure is self-assembled and self-aligned, a lesser number of processing steps are required to create the photonic device in comparison to the known approach that uses wet chemical etching techniques to form the ridge structure. The high precision of the ridge structure and the lesser number of processing steps needed to create the device increase manufacturing yield and allow overall cost of the device to be reduced.
机译:SAG技术用于在光子半导体器件(例如与分布式反馈激光器(EML)组件集成在一起的电吸收调制器)中生长脊结构。采用这种SAG技术来生长脊结构会导致形成具有非常精确配置的自组装和自对准脊结构。使用该工艺使得能够以高精度形成直的,弯曲的和倾斜的脊结构。另外,由于脊结构是自组装和自对准的,因此与使用湿化学蚀刻技术形成脊结构的已知方法相比,制造光子器件所需的处理步骤更少。脊结构的高精度和制造装置所需的较少处理步骤增加了制造良率,并降低了装置的总成本。

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