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Semiconductor device including a semiconductor substrate formed with a shallow impurity region

机译:包括形成有浅杂质区的半导体衬底的半导体器件

摘要

A method of manufacturing a semiconductor device includes forming isolation regions, a gate insulator film and gate electrodes, implanting in the silicon substrate with impurity ions, annealing to recover crystallinity of the implanted silicon substrate without diffusing the impurity ions, depositing an interlayer insulator film on the isolation regions, the silicon substrate, and the gate electrodes, and heating the silicon substrate by irradiating a light having a wavelength that the light is absorbed by the silicon substrate without being absorbed by the interlayer insulator film, activating the impurity ions so as to form source and drain regions.
机译:制造半导体器件的方法包括:形成隔离区,栅绝缘膜和栅电极;用杂质离子注入硅衬底中;退火以恢复注入的硅衬底的结晶度而不扩散杂质离子;在其上沉积层间绝缘膜。隔离区域,硅衬底和栅电极,并通过照射具有被硅衬底吸收而不被层间绝缘膜吸收的波长的光来加热硅衬底,从而激活杂质离子,从而形成源漏区。

著录项

  • 公开/公告号US7453090B2

    专利类型

  • 公开/公告日2008-11-18

    原文格式PDF

  • 申请/专利权人 TAKAYUKI ITO;

    申请/专利号US20070700849

  • 发明设计人 TAKAYUKI ITO;

    申请日2007-02-01

  • 分类号H01L29/12;

  • 国家 US

  • 入库时间 2022-08-21 19:29:50

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