Apparatus and method that minimizing dimensional instability and solder stress in surface mounted interconnections

摘要

A surface mounted apparatus for use with electrical component interconnections including a planar surface, a slide disposed proximate to the planar surface and being made of a material having a coefficient of thermal expansion (CTE) that is substantially matched to that of a material of the planar surface, the slide being further configured to accommodate solderable contact elements stitched therethrough and soldered to the planar surface, a connector body to support the slide in a cavity defined therein, the cavity being sufficiently large to allow the slide to float in accordance with thermal expansions and contractions of the slide and the planar surface, which respectively occur during solder reflow and subsequent cool-down of the connector assembly.