MAGNETRON SPUTTERING SOURCE, SPUTTER-COATING INSTALLATION, AND METHOD FOR COATING A SUBSTRATE

摘要

A magnetron sputter source for a sputter-coating installation 1, comprises at least one cathode 3 and at least one target 4 assigned to the cathode or formed as cathode. The target 4 provides coating and/or treatment material for the coating and/or treatment of a substrate. Furthermore, the magnetron sputtering source has means for generating a coating plasma, at least one magnet arrangement 7 for generating a magnetic field for the purpose of influencing the coating plasma such that at least one plasma channel 8 is generated above one section of the surface 4' of the target 4. The magnet arrangement 7 and the surface 4' of the target 4 are arranged such that they can be moved relative to each other such that the plasma channel 8 is traversable above the surface 4' of the target 4. The magnetron sputtering source is adjusted such that, when the plasma channel 8 moves over the surface region of the target 4, the entire duration of exposure of the surface region to the plasma is reduced by an increase in the relative velocity v between the magnet arrangement 7 and the target 4. (Fig. 2) TO, Controller of Patents Patent Office Branch IPR Building, GST Road, GUINDY, CHENNAI-600 032 Ph: 044-22322874/875