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A METHOD FOR FORMING A RELAXED EPITAXIAL SI1-xGEx LAYER WITH A LOW-DENSITY OF THREADING DISLOCATIONS ON A SINGLE CRYSTALLINE SURFACE
A METHOD FOR FORMING A RELAXED EPITAXIAL SI1-xGEx LAYER WITH A LOW-DENSITY OF THREADING DISLOCATIONS ON A SINGLE CRYSTALLINE SURFACE
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机译:一种在单晶表面上形成低密度螺旋位移的松弛表位SI1-xGEx层的方法
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摘要
A method to obtain thin (less than 300 nm) strain-relaxed SiSUB1-x/SUBGeSUBx/SUB buffer layers on Si or silicon-on-insulator (SOI) substrates. These buffer layers have a homogeneous distribution of misfit dislocations that relieve the strain, remarkably smooth surfaces, and a low threading dislocation (TD) density, i.e. less than 10SUP6/SUPcmSUP2/SUP. The approach begins with the growth of a pseudomorphic or nearlypseudomorphic SSUB1-x/SUBGeSUBx/SUB layer, i.e., a layer that is free of misfit dislocations, which is then implanted with He or other light elements and subsequently annealed to achieve the substantial strain relaxation. The very effective strain relaxation mechanism operatiing with this method is dislocation nucleation at He-inducedplatelets (not bubbles) that lie below the SSUB1-x/SUBGeSUBx/SUB interface, parallel to the Si(001) surface
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机译:一种在Si或绝缘体上硅(SOI)衬底上获得薄的(小于300 nm)应变松弛的Si 1-x SUB> Ge x SUB>缓冲层的方法。这些缓冲层具有错位错位的均匀分布,可以缓解应变,表面非常光滑,螺纹位错(TD)密度低,即小于10 6 SUP> cm 2 SUP> 。该方法始于伪晶或近伪晶S 1-x SUB> Ge x SUB>层的生长,即没有失配位错的层,然后注入He或其他轻元素,然后退火以实现基本的应变松弛。使用此方法最有效的应变松弛机制是位于S 1-x SUB> Ge x SUB>界面以下且平行于Si(001)表面
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