METHODS, DESIGNS, DEFECT REVIEW TOOLS, AND SYSTEMS FOR DETERMINING LOCATIONS ON A WAFER TO BE REVIEWED DURING DEFECT REVIEW

摘要

Various methods, designs, defect review tools, and systems for determininglocations on a wafer to be reviewed during defect review are provided. One computer-implementedmethod includes acquiring coordinates of defects detected by two or more inspectionsystems. The defects do not include defects detected on the wafer. The methodalso includes determining coordinates of the locations on the wafer to be reviewedduring the defect review by translating the coordinates of the defects into thecoordinates on the wafer such that results of the defect review performed at thelocations can be used to determine if the defects cause systematic defects onthe wafer.