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Methods, designs, defect review tools and systems for determining locations on a wafer to be reviewed during defect review
Methods, designs, defect review tools and systems for determining locations on a wafer to be reviewed during defect review
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机译:用于确定缺陷检查期间要检查的晶片上位置的方法,设计,缺陷检查工具和系统
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摘要
Various methods, designs, defect review tools, and systems for determining locations on a wafer to be reviewed during defect review are provided. One computer-implemented method includes acquiring coordinates of defects detected by two or more inspection systems. The defects do not include defects detected on the wafer. The method also includes determining coordinates of the locations on the wafer to be reviewed during the defect review by translating the coordinates of the defects into the coordinates on the wafer such that results of the defect review performed at the locations can be used to determine if the defects cause systematic defects on the wafer.
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