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SEMICONDUCTOR PACKAGE-ON-PACKAGE SYSTEM INCLUDING INTEGRATED PASSIVE COMPONENTS
SEMICONDUCTOR PACKAGE-ON-PACKAGE SYSTEM INCLUDING INTEGRATED PASSIVE COMPONENTS
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机译:包含集成无源组件的半导体封装系统
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摘要
A semiconductor system (300) has one or more packaged active subsystems (310, 330); each subsystem has a substrate with electrical contact pads and one or more semiconductor chips stacked on top of each other, assembled on the substrate. The system further has a packaged passive subsystem (320) including a substrate with electrical contacts and passive electrical components, such as resistors, capacitors, and indictors. The passive subsystem is stacked with the active subsystems and connected to them by solder bodies.
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