首页> 外国专利> HIGH OUTPUT POWER AMPLIFIER, WIRELESS TRANSMITTER, WIRELESS TRANSMITTING AND RECEIVING DEVICE, AND HIGH OUTPUT POWER AMPLIFIER MOUNTING METHOD

HIGH OUTPUT POWER AMPLIFIER, WIRELESS TRANSMITTER, WIRELESS TRANSMITTING AND RECEIVING DEVICE, AND HIGH OUTPUT POWER AMPLIFIER MOUNTING METHOD

机译:高输出功率放大器,无线发送器,无线发送和接收装置以及高输出功率放大器的安装方法

摘要

It is an object to provide a high output power amplifier, a wireless transmitter and a high output power amplifier mounting method that are high in heat dissipation effect and low in cost. A high output power amplifier is comprised of a transistor with a lead wire extending from both side surfaces of a mold set on a heat radiation member to the outside, a bifacial wiring board that has an aperture where the heat radiation member is inserted and a wiring pattern on its one surface where the lead wire is electrically connected, and a case that receives the bifacial wiring board, wherein the high output power amplifier is further provided with a plate, one main surface of which is in contact with the inner wall of the case while the other main surface of which is connected with the heat radiation member and a wiring pattern of the other main surface of the bifacial wiring board.
机译:目的是提供散热效果高且成本低的高输出功率放大器,无线发射机和高输出功率放大器安装方法。一种高输出功率放大器,包括:晶体管,其引线从设置在散热构件上的模具的两个侧面延伸到外部;双面布线板,其上插入有散热构件的孔;以及布线在其与导线电连接的一个表面上的图案以及容纳双面布线板的壳体,其中高输出功率放大器还设有板,该板的一个主表面与板的内壁接触。这种情况下,其另一主表面与散热构件以及双面布线板的另一主表面的布线图案连接。

著录项

  • 公开/公告号WO2009037995A1

    专利类型

  • 公开/公告日2009-03-26

    原文格式PDF

  • 申请/专利权人 NEC CORPORATION;ISHINO TOORU;

    申请/专利号WO2008JP66262

  • 发明设计人 ISHINO TOORU;

    申请日2008-09-09

  • 分类号H03F3/24;H03F1/30;H03F3/193;H03F3/60;H05K1/18;

  • 国家 WO

  • 入库时间 2022-08-21 19:19:52

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