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High power amplifier, wireless transmitter, wireless transceiver, and high power amplifier mounting method

机译:大功率放大器,无线发射器,无线收发器和大功率放大器的安装方法

摘要

Provided are a high-power amplifier, a radio transmitter, a radio transceiver, and a high-power amplifier mounting method that have a high heat radiation effect and are low in cost. A transistor having a lead wire extending outward from both side surfaces of the mold provided on the heat radiating member, the heat radiating member is inserted into the opening, and a wiring pattern on one surface is electrically connected to the lead wire. A high-power amplifier having a double-sided wiring board and a case for housing the double-sided wiring board, wherein one main surface is in contact with the inner wall of the case and the other main surface is the heat dissipation member And a plate connected to the wiring pattern on the other main surface of the double-sided wiring board.
机译:提供了具有高散热效果且成本低的大功率放大器,无线电发射机,无线电收发机以及大功率放大器安装方法。一种晶体管,其具有从设置在散热构件上的模具的两个侧面向外延伸的导线,该散热构件插入到开口中,并且一个表面上的布线图案电连接到导线。一种具有双面布线板和用于容纳该双面布线板的壳体的大功率放大器,其中,一个主表面与所述壳体的内壁接触,而另一个主表面为散热构件。板连接到双面布线板另一个主表面上的布线图。

著录项

  • 公开/公告号JPWO2009037995A1

    专利类型

  • 公开/公告日2011-01-06

    原文格式PDF

  • 申请/专利权人 日本電気株式会社;

    申请/专利号JP20090533112

  • 发明设计人 石野 徹;

    申请日2008-09-09

  • 分类号H01L23/34;H03F3/24;H01L23/36;H01L25/07;H01L25/18;

  • 国家 JP

  • 入库时间 2022-08-21 18:16:40

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