首页> 外国专利> HIGH OUTPUT POWER AMPLIFIER, WIRELESS TRANSMITTER, WIRELESS TRANSMITTING AND RECEIVING DEVICE, AND HIGH OUTPUT POWER AMPLIFIER MOUNTING METHOD

HIGH OUTPUT POWER AMPLIFIER, WIRELESS TRANSMITTER, WIRELESS TRANSMITTING AND RECEIVING DEVICE, AND HIGH OUTPUT POWER AMPLIFIER MOUNTING METHOD

机译:高输出功率放大器,无线发送器,无线发送和接收装置以及高输出功率放大器的安装方法

摘要

A high power amplifier that has a high heat dissipation effect and is produced at low cost, a wireless transmitter and a wireless transceiver with the high power amplifier and a method for mounting a high power amplifier are provided. The high power amplifier comprises a transistor with lead wires extending from both side surfaces of a mold provided on a heat dissipation member to the outside, a double-sided wiring board of which the heat dissipation member is inserted in an opening of the double-sided wiring board and a wiring pattern on one surface of the double-sided wiring board is electrically connected to the lead wires, and a case for accommodating the double-sided wiring board. Further, the high power amplifier comprises a plate of which one main surface is in contact with an inner wall of the case and the other main surface is connected to the heat dissipation member and a wiring pattern on the other main surface of the double-sided wiring board.
机译:提供了具有高散热效果并且以低成本制造的高功率放大器,具有该高功率放大器的无线发送器和无线收发器以及用于安装高功率放大器的方法。高功率放大器包括晶体管,该晶体管的引线从设置在散热构件上的模具的两个侧面延伸到外部,该双面布线板的散热构件插入到该双面布线的开口中。布线板和双面布线板的一个表面上的布线图案与引线电连接,并且壳体用于容纳双面布线板。此外,高功率放大器包括板,该板的一个主表面与壳体的内壁接触,并且另一主表面连接至散热构件,并且在该双面的另一主表面上具有配线图案。接线板。

著录项

  • 公开/公告号EP2180595A4

    专利类型

  • 公开/公告日2010-09-08

    原文格式PDF

  • 申请/专利权人 NEC CORPORATION;

    申请/专利号EP20080832206

  • 发明设计人 ISHINO TOORU;

    申请日2008-09-09

  • 分类号H03F3/24;H03F1/30;H03F3/193;H03F3/60;H05K1/18;

  • 国家 EP

  • 入库时间 2022-08-21 18:35:18

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