首页> 外国专利> COMPOSITION FOR THIN-FILM CAPACITIVE DEVICE, HIGH-DIELECTRIC CONSTANT INSULATING FILM, THIN-FILM CAPACITIVE DEVICE, AND THIN-FILM MULITLAYER CERAMIC CAPACITOR

COMPOSITION FOR THIN-FILM CAPACITIVE DEVICE, HIGH-DIELECTRIC CONSTANT INSULATING FILM, THIN-FILM CAPACITIVE DEVICE, AND THIN-FILM MULITLAYER CERAMIC CAPACITOR

机译:薄膜电容设备,高介电常数绝缘薄膜,薄膜电容设备和薄膜多层陶瓷电容的组成

摘要

A thin-film capacitor(2) in which a lower electrode(6), a dielectric thin-film(8), and an upper electrode(10) are formed in order on a substrate(4). The dielectric thin-film (8) is made of a composition for thin-film capacitance devices. The composition includes a bismuth layer-structured compound whose c-axis is oriented vertically to the substrate and which is expressed by a formula: (Bi2O2)2+(Am-1BmO3m+1)2-, or Bi2Am-1BmO3m+3 wherein "m" is an even number, "A" is at least one element selected from Na, K, Pb, Ba, Sr, Ca and Bi, and "B" is at least one element selected from Fe, Co, Cr, Ga, Ti, Nb, Ta Sb, V, Mo and W. The temperature characteristics of the dielectric constant are excellent. Even if the dielectric thin-film is made more thinner, the dielectric constant is relatively high, and the loss is small. The leak characteristics are excellent, the break-down voltage is improved and the surface smoothness is excellent. IMAGE
机译:在基板(4)上依次形成有下部电极(6),电介质薄膜(8)和上部电极(10)的薄膜电容器(2)。电介质薄膜(8)由用于薄膜电容装置的组合物制成。该组合物包括铋层结构的化合物,其c轴垂直于基材取向,并由下式表示:(Bi 2 O 2)2+(Am-1BmO3m + 1)2-或Bi2Am-1BmO3m +3其中“ m”是偶数,“ A”是选自Na,K,Pb,Ba,Sr,Ca和Bi中的至少一种元素,而“ B”是选自Fe,Co中的至少一种元素, Cr,Ga,Ti,Nb,Ta Sb,V,Mo和W。介电常数的温度特性极好。即使使电介质薄膜更薄,介电常数也相对较高,损耗也较小。泄漏特性极好,击穿电压得到改善,表面光滑度极好。 <图像>

著录项

  • 公开/公告号EP1422727A4

    专利类型

  • 公开/公告日2009-01-21

    原文格式PDF

  • 申请/专利权人 TDK CORPORATION;

    申请/专利号EP20020760745

  • 发明设计人 SAKASHITA YUKIO;FUNAKUBO HIROSHI;

    申请日2002-08-26

  • 分类号H01B3/12;H01G4/33;C01G29/00;C04B35/00;H01G4/12;H01G4/30;

  • 国家 EP

  • 入库时间 2022-08-21 19:18:57

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