Alternating micro-vias and through-hole vias for a BGA interconnect grid in order to create improved PCB routing channels

摘要

A printed circuit board (PCB) assembly having a plurality of circuit layers including outer layers and intervening layers with through-vias (12') and micro-vias (MV) used to translate a portion of the signal connections of the grid, thereby creating a set of diagonal routing channels between the vias on internal layers of the board and a BGA package mounted on the printed circuit board.