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Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid
Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid
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机译:交替使用微孔和贯穿板过孔,以在BGA互连网格中创建PCB布线通道
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摘要
A printed circuit board (PCB) assembly having a plurality of circuit layers including outer layers and intervening layers with through-vias and micro-vias used to translate a portion of the signal connections of the grid, thereby creating a set of diagonal routing channels between the vias on internal layers of the board and a BGA package mounted on the printed circuit board.
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